LED lighting bulb production process

When the LED lighting economy is booming, perhaps to break through or summarize, lighting is divided into three eras:

1. incandescent bulb era

2. Gas bulb (fluorescent) era

3. semiconductor light-emitting age (LED)

Among them, the longest history of incandescent lamps and the future mainstream LED is the most important test point. Regardless of the development of the times, the production process of the lighting industry is strikingly similar, except that China is also in the downstream of the industry. The core technology is basically owned by Europe, America, Japan and other countries and regions.

1, LED light-emitting principle is that when the electrons through a layer of semiconductor material, the semiconductor material is excited to convert electrical energy into light energy. However, a single layer of semiconductor light-emitting ability is very weak, so it is necessary to stack multiple layers of single-layer materials and press it into a layer cake-like composite material, which is “epitaxial wafer”. Therefore, the luminous efficiency of an LED depends on how many layers can be pressed to the same thickness. The thinner the monolayer material, the more layers can be stacked, the higher the luminous efficiency. At present, the thickness of each layer is generally only 2-20 microns, which also determines the production of epitaxial wafers is the most difficult part of the entire LED production process.

2、Cutting the LED core: equivalent to pulling out the filament from the tungsten material, the difference is that the cut epitaxial wafer is square. Banding

Due to the special structure of the epitaxial wafer, it is difficult to cut out the light-emitting core completely. Not only does it require a vacuum environment, but also a specialized cutting machine. At present, there are only two manufacturers in the world that produce this kind of cutting machine.

3, put the core into the LED chip: the chip is for the LED, just like the lamp holder is for the bulb, it is the power supply part. The “chip” is a very important device to realize the ideal effect of LED, because LED has high requirements for current.

4, the LED chip package into a light-emitting body: the LED chip package into a light-emitting body, just like in the incandescent lamp base with a lampshade to make a light bulb. The shape of the lampshade can be different according to the need, but the packaging technology determines the service life of the luminous body.

5. Lighting applications: just like the use of incandescent bulbs, can be assembled into different LED products according to different functions and needs.

For LED lighting, the first three steps of epitaxial wafer, cutting and chip are upstream, the fourth step of packaging is midstream, and the fifth step of application is downstream.